The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Oct. 04, 2018
Xsense Technology Corporation, Tortola, VG;
Chen-Yu Li, Miaoli County, TW;
Chia-Jung Chen, Miaoli County, TW;
Yeu-Wen Huang, Miaoli County, TW;
Chun-Chung Lin, Miaoli County, TW;
Chih-Lung Lin, Miaoli County, TW;
XSENSE TECHNOLOGY CORPORATION, Tortola, VG;
Abstract
The present disclosure provides an element submount and a method for manufacturing the same. The element submount includes a substrate, a first conductive heat-dissipating layer, a second conductive heat-dissipating layer, a first heat-dissipating layer and an element bonding layer. The substrate has opposite first and second surfaces. The first conductive heat-dissipating layer is formed on the first surface. The second conductive heat-dissipating layer is formed on the first surface and separated from the first conductive heat-dissipating layer. The first heat-dissipating layer is formed on the second surface. The element bonding layer is formed on the second conductive heat-dissipating layer. By electroplating and processing techniques, the edge of one or two sides of the element bonding layer exceeds an edge of the second conductive heat-dissipating layer and partially covers a side of the second conductive heat-dissipating layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile