The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Oct. 30, 2018
Applicant:
Amazon Technologies, Inc., Seattle, WA (US);
Inventors:
Jonathan Barak Flowers, Edgware, GB;
Herbert Mehnert, Seattle, WA (US);
Assignee:
Amazon Technologies, Inc., Seattle, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01); C12M 1/00 (2006.01); H05K 1/09 (2006.01); H01B 7/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0272 (2013.01); H01B 7/423 (2013.01); H05K 1/0201 (2013.01); H05K 1/09 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01); H05K 2201/093 (2013.01); H05K 2201/10083 (2013.01);
Abstract
Microfluidic channels and pumps for active cooling of circuit boards are described. One circuit board includes a substrate and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel. Liquid metal is disposed in the microfluidic channel and a pump pumps the liquid metal through the microfluidic channel to actively cool at least a portion of the circuit board.