The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
May. 02, 2017
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventor:
Yang Hyun Kim, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/538 (2006.01); H01L 23/48 (2006.01); H05K 1/11 (2006.01); H02J 7/00 (2006.01); H02J 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/023 (2013.01); H01L 23/48 (2013.01); H01L 23/538 (2013.01); H02J 7/0029 (2013.01); H02J 7/14 (2013.01); H05K 1/02 (2013.01); H05K 1/0215 (2013.01); H05K 1/0254 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H02J 7/00304 (2020.01);
Abstract
An embodiment provides a printed circuit board and an electronic component package including the same, the printed circuit board comprising: a data line layer; a ground layer disposed on the data line layer; a power line layer disposed on the ground layer; and insulation layers disposed between the data line layer and the ground layer and between the ground layer and the power line layer, respectively, wherein the ground layer comprises a common ground and a chassis ground electrically insulated from the common ground.