The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Jun. 05, 2017
Applicant:
Kabushiki Kaisha Toyota Jidoshokki, Aichi-ken, JP;
Inventors:
Assignee:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, Aichi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); H01F 27/40 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H01F 5/00 (2006.01); H05K 3/46 (2006.01); H02M 7/00 (2006.01); H05K 1/11 (2006.01); H02M 3/335 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H01F 5/00 (2013.01); H01F 27/28 (2013.01); H02M 7/003 (2013.01); H05K 1/115 (2013.01); H05K 1/16 (2013.01); H05K 1/165 (2013.01); H05K 1/185 (2013.01); H05K 3/46 (2013.01); H02M 3/335 (2013.01); H05K 3/4644 (2013.01);
Abstract
A multilayer substrate includes a first metal plate forming a first coil; a second metal plate facing the first metal plate in a coil-winding axis direction and forming a second coil; a first insulating layer having therein the first metal plate; and a second insulating layer having therein the second metal plate. A metal foil is connected to the first metal plate through a plurality of via holes. An electronic component embedded in the first insulating layer is connected to a pattern formed on the metal foil.