The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Nov. 01, 2017
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;

Inventors:

Gu Yao, Beijing, CN;

Qinghua Zou, Beijing, CN;

Tingyuan Duan, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); H01L 51/50 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); C23C 14/54 (2006.01); C23C 14/24 (2006.01); C23C 14/04 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); C23C 14/042 (2013.01); C23C 14/24 (2013.01); C23C 14/541 (2013.01); H01L 27/3244 (2013.01); H01L 51/001 (2013.01); H01L 51/5012 (2013.01); H01L 51/0011 (2013.01);
Abstract

The present application discloses an evaporation plate for depositing a deposition material on a substrate. The evaporation plate has a first side and a second side opposite to the first side. The evaporation plate includes a main body plate; a first cooling layer on the main body plate and on the first side of the evaporation plate; and a first heating layer on a side of the first cooling layer distal to the main body plate. The first cooling layer is configured to cool the first heating layer on the first side of the evaporation plate. The first heating layer is configured to heat a material deposited on the first side of the evaporation plate.


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