The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Sep. 24, 2018
Applicant:

Hoya Candeo Optronics Corporation, Toda-shi, Saitama, JP;

Inventors:

Yasuo Kogure, Toda, JP;

Shinichi Ogawa, Toda, JP;

Satoshi Yajima, Toda, JP;

Assignee:

HOYA CANDEO OPTRONICS CORPORATION, Toda-Shi, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/36 (2010.01); H01L 33/44 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/36 (2013.01); H01L 33/44 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01);
Abstract

Provided is an optical semiconductor apparatus including an optical semiconductor device; a light-permeable buffer layer that contains a cured high-hardness silicone resin, that has a thickness ranging from 1 μm to 300 μm, and that covers at least part of a light-emitting surface of the optical semiconductor device; and a flexible sealing layer containing a cured flexible silicone resin that has a lower hardness than the light-permeable buffer layer, and that covers the optical semiconductor device and the light-permeable buffer layer. The optical semiconductor apparatus has superior heat resistance and UV resistance and is significantly prevents the breakage of a wire electrically connected to the optical semiconductor device.


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