The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Jun. 22, 2015
Applicant:

Inkron Oy, Espoo, FI;

Inventors:

Juha Rantala, Espoo, FI;

Jarkko Heikkinen, Espoo, FI;

Janne Kylmä, Espoo, FI;

Assignee:

Inkron Oy, Espoo, FI;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 33/50 (2010.01); H01L 23/00 (2006.01); H01L 21/324 (2006.01); H01L 21/56 (2006.01); F21K 9/20 (2016.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 24/26 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

An LED lamp is formed from a die substrate wherein the substrate has formed thereon a semiconductor material, an electrode for the application of a bias across the semiconductor material for causing light to be emitted therefrom, and an adhesive that bonds the die substrate to a support substrate, wherein the adhesive is a polymerized siloxane polymer having a thermal conductivity of greater than 0.1 watts per meter kelvin (W/(m·K)) wherein the adhesive is not light absorbing, wherein the siloxane polymer has silicon and oxygen in the polymer backbone, as well as aryl or alky groups bound thereto, and wherein the adhesive further comprises particles having an average particle size of less than 100 microns.


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