The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Nov. 10, 2018
Applicant:
Xiamen San'an Optoelectronics Co., Ltd., Xiamen, CN;
Inventors:
Junpeng Shi, Xiamen, CN;
Qiuxia Lin, Xiamen, CN;
Zhenduan Lin, Xiamen, CN;
Chen-Ke Hsu, Xiamen, CN;
Chih-Wei Chao, Xiamen, CN;
Assignee:
XIAMEN SAN'AN OPTOELECTRONICS CO., LTD., Xiamen, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/44 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2924/16195 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01);
Abstract
A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.