The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Jan. 29, 2019
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventor:

Masao Uchida, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 29/06 (2006.01); H01L 29/24 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 29/0619 (2013.01); H01L 29/0692 (2013.01); H01L 29/08 (2013.01); H01L 29/24 (2013.01); H01L 29/6606 (2013.01); H01L 29/66143 (2013.01); H01L 29/66212 (2013.01); H01L 29/66969 (2013.01); H01L 29/872 (2013.01);
Abstract

A semiconductor element includes: a semiconductor substrate of a first conduction type; a silicon carbide semiconductor layer of the first conduction type disposed above a principal surface of the semiconductor substrate; a terminal edge region of a second conduction type disposed in the silicon carbide semiconductor layer; an insulating film; a first electrode disposed on the silicon carbide semiconductor layer; and a seal ring surrounding the first electrode. The terminal edge region is disposed to surround part of a surface of the silicon carbide semiconductor layer when viewed in a normal direction of the principal surface of the semiconductor substrate. The terminal edge region includes a guard ring region of the second conduction type, and a terminal edge injection region of the second conduction type. The seal ring is formed on the terminal edge injection region through an opening disposed on the insulating film.


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