The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Jun. 08, 2018
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Ryosuke Sawabe, Yokkaichi, JP;

Shigeru Kinoshita, Yokohama, JP;

Kenta Yamada, Yokkaichi, JP;

Hirokazu Ishigaki, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 21/28 (2006.01); H01L 27/1157 (2017.01); H01L 21/02 (2006.01); H01L 29/10 (2006.01); H01L 29/51 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/02532 (2013.01); H01L 21/02636 (2013.01); H01L 27/1157 (2013.01); H01L 29/1037 (2013.01); H01L 29/40117 (2019.08); H01L 29/513 (2013.01); H01L 21/0217 (2013.01); H01L 21/0274 (2013.01); H01L 21/02164 (2013.01); H01L 21/02271 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/32136 (2013.01); H01L 29/518 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a substrate, a stacked body, and a columnar portion. The stacked body, provided on the substrate, includes first conductive layers and first insulating layers provided alternately along a first direction. The columnar portion extends through the stacked body in the first direction. The columnar portion includes a blocking layer, a charge storage layer, a tunneling layer, and a semiconductor layer. The columnar portion includes a first portion and a second portion. The second portion is provided on the substrate side of the first portion. A dimension in the second direction of the second portion is smaller than a dimension in a second direction of the first portion. A portion of the blocking layer is provided at the second portion being thicker than a portion of the blocking layer provided at the first portion.


Find Patent Forward Citations

Loading…