The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Sep. 09, 2019
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Mankyo Jong, Bucheon-si, KR;
Changyoung Park, Ilsan-si, KR;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
In a general aspect, a method for producing a circuit assembly can include coupling a first side of a first semiconductor die with a first side of a first substrate and a first side of a second substrate, the first substrate having a first electrically isolated metal layer disposed on a second side. The method can also include coupling a first side of a second semiconductor die with a second side of the second substrate and a first side of a third substrate, the third substrate having a second electrically isolated metal layer disposed on a second side. The method can further include coupling at least one conductive connector between the second substrate and the third substrate, the at least one conductive connector electrically coupling the second substrate with the third substrate.