The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Dec. 13, 2018
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Ki Jun Sung, Cheongju-si, KR;
Jong Hoon Kim, Suwon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/486 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/5381 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 23/373 (2013.01); H01L 2224/0237 (2013.01);
Abstract
A stack package includes a second sub-package stacked on a first sub-package. The stack package also includes a plurality of dummy balls located between the first and second sub-packages to support the second sub-package. Each of the first and second sub-packages includes a semiconductor die and a bridge, die which are spaced apart from each other.