The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Feb. 28, 2019
Skyworks Solutions, Inc., Woburn, MA (US);
David T. Petzold, Chelmsford, MA (US);
David Scott Whitefield, Andover, MA (US);
Skyworks Solutions, Inc., Woburn, MA (US);
Abstract
A method for fabricating a semiconductor die involves providing a semiconductor substrate, forming a plurality of active devices and a plurality of passive devices over the semiconductor substrate, forming one or more electrical connections to the plurality of active devices and the plurality of passive devices, forming one or more dielectric layers over at least a portion of the electrical connections, applying an interface material over at least a portion of the one or more dielectric layers, removing portions of the interface material to form a plurality of trenches, and covering at least a portion of the interface material and the plurality of trenches with a substrate layer to form a plurality of radio-frequency isolation cavities.