IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10658304 B1

PDFFull Text
Date of Patent:
May. 19, 2020

Filed:

Nov. 28, 2018

Semiconductor device and method for manufacturing the same

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Hideaki Yanagida, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Jonathan Han

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4817 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15173 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device includes an electroconductive shielding layer, an isolation layer formed with a frame-shaped opening, a wiring layer on the isolation layer to be surrounded by the opening, a semiconductor element on the wiring layer with its back surface facing the wiring layer, electroconductive pillars spaced apart from the semiconductor element and standing on the wiring layer, and an electroconductive frame standing on an exposed region of the shielding layer through the opening, with the frame surrounding the semiconductor element and the electroconductive pillars. The semiconductor device further includes an electrically insulating sealing resin that covers the wiring layer and the semiconductor element, and the frame is configured to be electrically connected to an external ground terminal.

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