The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10658293 B1

Date of Patent:

May. 19, 2020

Filed:

Dec. 26, 2018

Semiconductor device having a multilayer wiring structure

Applicant:

Socionext Inc., Yokohama-shi, Kanagawa, JP;

Inventor:

Tomoyuki Kirimura, Yokohama, JP;

Assignee:

SOCIONEXT INC., Yokohama-shi, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Scott B Geyer

Int. Cl.

CPC ...

H01L 23/528 (2006.01); H01L 27/118 (2006.01); G06F 30/00 (2020.01); G06F 30/394 (2020.01); H01L 23/522 (2006.01); H01L 23/58 (2006.01); H01L 27/02 (2006.01); H01L 27/092 (2006.01); H01L 29/78 (2006.01); H01L 29/775 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/311 (2006.01); H01L 21/321 (2006.01); H01L 21/8238 (2006.01); H01L 23/532 (2006.01); H01L 29/167 (2006.01);

U.S. Cl.

CPC ...

H01L 23/5286 (2013.01); G06F 30/00 (2020.01); G06F 30/394 (2020.01); H01L 23/5226 (2013.01); H01L 23/58 (2013.01); H01L 27/0207 (2013.01); H01L 27/092 (2013.01); H01L 27/11807 (2013.01); H01L 29/785 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/26513 (2013.01); H01L 21/31111 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76802 (2013.01); H01L 21/76816 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 21/823871 (2013.01); H01L 21/823878 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 23/53295 (2013.01); H01L 27/0924 (2013.01); H01L 29/167 (2013.01); H01L 29/775 (2013.01); H01L 2027/11875 (2013.01); H01L 2027/11881 (2013.01); H01L 2027/11887 (2013.01);

Abstract

A semiconductor device having a plurality of first wirings (X-direction) which include a first power supply line and a second power supply line, a plurality of third wirings (X-direction) which include a third (fourth) power supply line that is located above the first (second) power supply line and is electrically connected to the first (second) power supply line. The semiconductor device also has a plurality of second wirings (Y-direction) that include a first (second) connection wiring located above the first (second) power supply line and below the third (fourth) power supply line that is electrically connected to the first (second) power supply line and to the third (fourth) power supply line.

Find Patent Forward Citations