The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Oct. 28, 2016
Applicant:

Gemalto SA, Meudon, FR;

Inventors:

Line Degeilh, Gemenos, FR;

Remy Janvrin, Gemenos, FR;

Lucile Dossetto, Gemenos, FR;

Alain Le Loc'h, Gemenos, FR;

Jean-Christophe Fidalgo, Gemenos, FR;

Assignee:

THALES DIS FRANCE SA, Meudon, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); G06K 19/07 (2006.01); G06K 19/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49855 (2013.01); G06K 19/0723 (2013.01); H01L 21/4867 (2013.01); G06K 19/00 (2013.01); H01L 2224/49171 (2013.01);
Abstract

The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.


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