The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Dec. 28, 2017
Applicant:
Analog Devices, Inc., Norwood, MA (US);
Inventors:
Jin Zou, Lexington, MA (US);
Gary T. Wenger, Harvard, MA (US);
Assignee:
Analog Devices, Inc., Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3732 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/5384 (2013.01);
Abstract
The disclosed technology generally relates to integrated circuit (IC) packages, and more particularly to integrated circuit packages comprising perforated diamond-based heat spreading substrates. In one aspect, a heat spreading substrate for an IC die is configured to be attached to an IC die and to spread heat away therefrom. The diamond-based heat spreading substrate can have an electrically conductive surface and an array of vias formed therethrough. At least one of the vias is configured to overlap an edge of the IC die when attached to the diamond-based heat spreading substrate.