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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10658185 B1

PDFFull Text
Date of Patent:
May. 19, 2020

Filed:

Jun. 02, 2017

Laser irradiation apparatus, method for manufacturing semiconductor device, and method for operating laser irradiation apparatus

Applicant:

The Japan Steel Works, Ltd., Shinagawa-ku, Tokyo, JP;

Inventors:

Ryo Shimizu, Yokohama, JP;

Ryosuke Sato, Yokohama, JP;

Teruaki Shimoji, Yokohama, JP;

Assignee:

THE JAPAN STEEL WORKS, LTD., Tokyo, JP;

Attorney:

SGPatents PLLC

Primary Examiner:

Angel Roman

Int. Cl.
CPC ...
H01L 21/268 (2006.01); H01L 21/677 (2006.01); B23K 26/073 (2006.01); G01J 1/42 (2006.01); H01L 21/02 (2006.01); H01L 29/786 (2006.01); B23K 26/00 (2014.01); B23K 26/70 (2014.01); B23K 26/352 (2014.01); G09F 9/00 (2006.01); B23K 26/12 (2014.01); H01L 21/67 (2006.01); B23K 26/08 (2014.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/268 (2013.01); B23K 26/0006 (2013.01); B23K 26/0732 (2013.01); B23K 26/0838 (2013.01); B23K 26/127 (2013.01); B23K 26/352 (2015.10); B23K 26/705 (2015.10); B23K 26/707 (2015.10); G01J 1/4257 (2013.01); G09F 9/00 (2013.01); H01L 21/02678 (2013.01); H01L 21/677 (2013.01); H01L 21/6776 (2013.01); H01L 21/67115 (2013.01); H01L 21/67784 (2013.01); H01L 29/786 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); H01L 21/02381 (2013.01); H01L 21/02422 (2013.01); H01L 21/02532 (2013.01); H01L 21/02675 (2013.01);
Abstract

A laser annealing apparatus () according to an embodiment includes a laser oscillator () configured to generate a laser beam (L), a floating-type conveying stage () configured to float and convey a workpiece (W) to be irradiated with the laser beam (L), and a beam profiler () configured to measure a beam profile of the laser beam (L). The floating-type conveying stage () includes a conveying surface () opposed to the workpiece (W), and a bottom surface () on the side opposite to the conveying surface (). The beam profiler () is positioned below the bottom surface () of the floating-type conveying stage (). The floating-type conveying stage () includes a detachable part () in a part of it. An opening (S) is formed by detaching the detachable part () from the floating-type conveying stage (), the opening () extending from the conveying surface () to the bottom surface (). The beam profiler () is configured to measure the beam profile of the laser beam (L) through the opening (S).

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