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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10656521 B1

PDFFull Text
Date of Patent:
May. 19, 2020

Filed:

Nov. 25, 2015

Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Tetsuya Kato, Tokyo, JP;

Kenichi Iwashita, Tokyo, JP;

Akihiro Nakamura, Tokyo, JP;

Akio Nakano, Tokyo, JP;

Hiroshi Ono, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
G03F 7/038 (2006.01); H05K 1/03 (2006.01); G03F 7/004 (2006.01); H05K 3/00 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/40 (2006.01); H01L 21/027 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); G03F 7/0045 (2013.01); G03F 7/0046 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); G03F 7/40 (2013.01); H01L 21/0274 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/145 (2013.01); H05K 1/0373 (2013.01); H05K 3/007 (2013.01); H05K 3/0023 (2013.01); H01L 21/2885 (2013.01); H05K 3/064 (2013.01); H05K 3/107 (2013.01); H05K 3/182 (2013.01); H05K 3/188 (2013.01); H05K 3/4602 (2013.01);
Abstract

A photosensitive resin composition comprises: a resin having a phenolic hydroxyl group; a photosensitive acid generator; a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; and an aliphatic compound having two or more functional groups, the functional groups being at least one functional group selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group, wherein the photosensitive acid generator is a sulfonium salt containing an anion having at least one skeleton selected from the group consisting of a tetraphenylborate skeleton, an alkylsulfonate skeleton having 1 to 20 carbon atoms, a phenylsulfonate skeleton and a 10-camphorsulfonate skeleton.

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