The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Nov. 14, 2016
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Johannes Classen, Reutlingen, DE;

Antoine Puygranier, Asperg, DE;

Denis Gugel, Dusslingen, DE;

Guenther-Nino-Carlo Ullrich, Reutlingen, DE;

Markus Linck-Lescanne, Wannweil, DE;

Sebastian Guenther, Tuebingen, DE;

Timm Hoehr, Reutlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/125 (2006.01); B81B 5/00 (2006.01); G01P 15/08 (2006.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); B81B 5/00 (2013.01); B81B 2201/02 (2013.01); B81B 2203/04 (2013.01); B81B 2203/051 (2013.01); G01P 2015/0814 (2013.01); G01P 2015/0871 (2013.01);
Abstract

A micromechanical structure for an acceleration sensor includes a movable seismic mass including electrodes, the seismic mass being attached to a substrate with the aid of an attachment element; first fixed counter electrodes attached to a first carrier plate; and second fixed counter electrodes attached to a second carrier plate, where the counter electrodes, together with the electrodes, are situated nested in one another in a sensing plane of the micromechanical structure, and where the carrier plates are situated nested in one another in a plane below the sensing plane, each being attached to a central area of the substrate with the aid of an attachment element.


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