The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Feb. 20, 2018
Applicant:
Invensense, Inc., San Jose, CA (US);
Inventors:
Assignee:
InvenSense, Inc., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01C 19/5712 (2012.01); G01P 15/125 (2006.01); G01C 19/574 (2012.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
G01C 19/5712 (2013.01); B81B 3/0059 (2013.01); G01C 19/574 (2013.01); G01P 15/125 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/0154 (2013.01); B81B 2203/0163 (2013.01); B81B 2203/0307 (2013.01);
Abstract
A MEMS sensor includes a substrate and a MEMS layer. A plurality of anchoring points within the MEMS layer suspend a suspended spring-mass system that includes active micromechanical components that respond to a force of interest such as linear acceleration, angular velocity, pressure, or magnetic field. Springs and rigid masses couple the active components to the anchoring points, such that displacements of the anchoring points do not substantially cause the active components within the MEMS layer to move out-of-plane.