The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Feb. 16, 2016
Jfe Steel Corporation, Tokyo, JP;
Nobusuke Kariya, Fukuyama, JP;
Yoshihiko Ono, Fukuyama, JP;
Yoshimasa Funakawa, Chiba, JP;
Kazuma Mori, Chiba, JP;
Reiko Sugihara, Chiba, JP;
JFE STEEL CORPORATION, Tokyo, JP;
Abstract
A high-strength, cold-rolled steel sheet having a tensile strength of 980 MPa or more, the steel sheet having a chemical composition containing, by mass %, C: 0.070% to 0.100%, Si: 0.50% to 0.70%, Mn: 2.40% to 2.80%, P: 0.025% or less, S: 0.0020% or less, Al: 0.020% to 0.060%, N: 0.0050% or less, Nb: 0.010% to 0.060%, Ti: 0.010% to 0.030%, B: 0.0005% to 0.0030%, Sb: 0.005% to 0.015%, Ca: 0.0015% or less, Cr: 0.01% to 2.00%, Mo: 0.01% to 1.00%, Ni: 0.01% to 5.00%, Cu: 0.01% to 5.00%, and the balance being Fe and inevitable impurities, a metallurgical microstructure including a ferrite phase in an amount of 30% or more in terms of area fraction, at least one selected from a bainite phase and a martensite phase in an amount of 40% to 65% in total in terms of area fraction, and a cementite in an amount of 5% or less in terms of area fraction at a position located at ¼ of the thickness from the surface of the steel sheet, and a metallurgical microstructure including a ferrite phase in an amount of 40% to 55% in terms of area fraction at a position located at 50 μm in the thickness direction from the surface of the steel sheet and a method for manufacturing the steel sheet.