The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Nov. 18, 2016
Applicants:

Mitsumi Electric Co., Ltd., Tokyo, JP;

Tsukasa Yamada, Tokyo, JP;

Takahiro Wakasugi, Tokyo, JP;

Shinobu Kasahara, Tokyo, JP;

Inventors:

Tsukasa Yamada, Tokyo, JP;

Takahiro Wakasugi, Tokyo, JP;

Shinobu Kasahara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); G02B 26/10 (2006.01); B81B 7/02 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0006 (2013.01); B81B 7/02 (2013.01); G02B 26/08 (2013.01); G02B 26/0858 (2013.01); G02B 26/10 (2013.01); B81B 2201/042 (2013.01); B81B 2207/07 (2013.01); B81B 2207/098 (2013.01);
Abstract

The present invention is to provide an optical scanner module capable of reducing cross-talk generated between a sensor interconnect and a drive interconnect. An optical scanner module, includes an optical scanner apparatus that scans incident light by oscillating a mirror; and a package on which the optical scanner apparatus is mounted, wherein the optical scanner apparatus includes a displacement sensor that detects an oscillation angle of the mirror, wherein a sensor interconnect (P) connected to the displacement sensor and a drive interconnect through which a drive signal for oscillating the mirror passes are respectively drawn from the optical scanner apparatus into the package, wherein interconnect layers (L, L) in which the sensor interconnect and the drive interconnect (P) are formed are stacked, wherein the sensor interconnect and the drive interconnect are placed not to overlap in a plan view of the interconnect layers, and wherein a GND interconnect (P) is provided between the sensor interconnect and the drive interconnect that are adjacent in a same interconnect layer.


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