The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Nov. 02, 2018
Applicant:

Spirit Aerosystems, Inc., Wichita, KS (US);

Inventor:

George M. Osborne, Wichita, KS (US);

Assignee:

Spirit AeroSystems, Inc., Wichita, KS (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01); B32B 27/08 (2006.01); B32B 3/26 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
B29C 66/006 (2013.01); B29C 65/4835 (2013.01); B29C 66/721 (2013.01); B32B 3/266 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 37/00 (2013.01); Y10T 428/24008 (2015.01);
Abstract

A part assembly including a curing shield and a method for secondarily bonding two parts of the part assembly utilizing the curing shield. The method for secondary bonding includes fixing a base of a clip of a curing shield to a first surface of a first part. The curing shield includes a pad fixed to the clip. The clip has the base and a spine fixed to and extending away from the base and terminating at a distal end. The pad extends along at least a portion of a length of the spine between the base and the distal end. The method also includes applying adhesive along a faying surface of one of the first part and a second part. The second part is assembled to the first part along the faying surface so that the distal end of the clip extends toward the second surface and the curing shield defines a pocket adjacent the faying surface at least partly enclosed by the pad.


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