logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10654215 B1

PDFFull Text
Date of Patent:
May. 19, 2020

Filed:

Sep. 02, 2016

Molding die device and molding method

Applicant:

Kyoraku Co., Ltd., Kyoto-Shi, Kyoto, JP;

Inventor:

Tatsuya Fukuda, Kanagawa, JP;

Assignee:

Kyoraku Co., Ltd., Kyoto, JP;

Attorney:

Maier & Maier, PLLC

Primary Examiner:

Matthew J Daniels

Assistant Examiner:

Abhishek A Patwardhan

Int. Cl.
CPC ...
B29C 51/36 (2006.01); B29C 49/04 (2006.01); B29C 49/42 (2006.01); B29C 51/26 (2006.01); B29C 48/00 (2019.01); B29C 51/02 (2006.01); B29C 51/10 (2006.01); B29C 48/07 (2019.01); B29C 51/16 (2006.01); B29C 33/00 (2006.01); B29C 51/32 (2006.01);
U.S. Cl.
CPC ...
B29C 51/36 (2013.01); B29C 49/04 (2013.01); B29C 49/42 (2013.01); B29C 51/26 (2013.01); B29C 33/005 (2013.01); B29C 48/0016 (2019.02); B29C 48/0017 (2019.02); B29C 48/07 (2019.02); B29C 49/4236 (2013.01); B29C 51/02 (2013.01); B29C 51/10 (2013.01); B29C 51/16 (2013.01); B29C 51/267 (2013.01); B29C 51/32 (2013.01); B29C 2791/006 (2013.01);
Abstract

A molding die device is provided for bringing a resin sheet into close contact with a pair of dies by vacuum suction from a cavity surface to perform molding. An outer frame portion is formed integrally with an outer peripheral portion of the respective dies arranged to face each other. Moreover, one of the dies has a recessed portion formed at the position of the one of the dies facing the outer frame portion of the other die and configured so that the outer frame portion of the one of the dies can be housed in the recessed portion. The outer frame portion is formed to protrude most in each die. Upon molding, the dies are clamped together after vacuum suction has been performed with the resin sheet being arranged in contact with the outer frame portions.

Find Patent Forward Citations

Fukuda, Tatsuya. (2020). Molding die device and molding method (U.S. Patent No. 10654215). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10654215

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…