The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Mar. 30, 2017
Applicant:

Nissei Plastic Industrial Co., Ltd., Nagano-ken, JP;

Inventor:

Hirofumi Murata, Nagano-ken, JP;

Assignee:

NISSEI PLASTIC INDUSTRIAL CO., LTD., Hanishina-Gun, Nagano-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/76 (2006.01); B29C 45/80 (2006.01); B29C 45/77 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7653 (2013.01); B29C 45/766 (2013.01); B29C 45/77 (2013.01); B29C 45/80 (2013.01); B29C 2945/76096 (2013.01); B29C 2945/76498 (2013.01); B29C 2945/76505 (2013.01); B29C 2945/76732 (2013.01); B29C 2945/76859 (2013.01); B29C 2945/76869 (2013.01); B29C 2945/76913 (2013.01); B29C 2945/76943 (2013.01);
Abstract

A specific mold status Ac is caused in advance in which the interval of an inner portion Xi in the parting plane direction of a parting gap C between a fixed moldand a movable moldduring the injection filling is larger than the interval of an outer edge portion Xo and the interval of the outer edge portion Xo is equal to or lower than a predetermined size Ls including 0. A molding injection pressure Pi is set as an injection pressure at which a non-defective product can be molded and a molding mold clamping force Pc is set as a mold clamping force by which a non-defective product can be molded. During the production, a moldis clamped by a molding mold clamping force Pc and the clamped moldis filled with the injected resin R by a molding injection pressure Pi. After a predetermined cooling time Tc has passed, a molded piece G is removed.


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