The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Apr. 10, 2018
Toyota Boshoku Kabushiki Kaisha, Aichi-ken, JP;
Hideo Kamiya, Aichi-ken, JP;
Masanori Hashiba, Gifu-ken, JP;
TOYOTA BOSHOKU KABUSHIKI KAISHA, Aichi-Ken, JP;
Abstract
Provided is a resin molding in which two types of substrates have a connection part constituted of a thin part provided from the one substrate to the other substrate with a boundary defined by end surfaces of the respective substrates, wherein the density of the one substrate in the connection part is higher than the density of a base part excluding the connection part. The resin molding can have a configuration in which the one substrate is a plate-like substrate including reinforcing fibers and a first thermoplastic resin binding the reinforcing fibers to each other and the other substrate is an injection-molded member connected along the plate face direction of the one substrate from an end surface of the one substrate. Moreover, it is preferred that the connection part have, on the side thereof closer to the other substrate, a section gradually thinned from a position at which the connection part extends and the connection interface be located at an intermediate part of the part that is gradually thinned. It is preferred that the reinforcing fibers be plant fibers, such as kenaf.