The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Jul. 12, 2016
Applicant:

Mc10, Inc., Lexington, MA (US);

Inventors:

Bryan McGrane, Cambridge, MA (US);

Milan Raj, Natick, MA (US);

PingHung Wei, Burlingame, MA (US);

Briana Morey, Somerville, MA (US);

Roozbeh Ghaffari, Cambridge, MA (US);

Monica Lin, San Jose, CA (US);

Jeffrey Model, Cambridge, MA (US);

Xianyan Wang, San Jose, CA (US);

Bryan Keen, Somerville, MA (US);

Stephen Lee, Ann Arbor, MI (US);

Assignee:

MC10, Inc., Lexington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); A61B 5/0496 (2006.01); A61B 5/00 (2006.01); A61B 5/0476 (2006.01); A61B 5/0488 (2006.01); A61B 5/0492 (2006.01); A61B 5/0478 (2006.01); A61B 5/0408 (2006.01); A61B 5/01 (2006.01); A61B 5/0402 (2006.01); A61B 5/053 (2006.01);
U.S. Cl.
CPC ...
A61B 5/0496 (2013.01); A61B 5/0408 (2013.01); A61B 5/0476 (2013.01); A61B 5/0478 (2013.01); A61B 5/0488 (2013.01); A61B 5/0492 (2013.01); A61B 5/6801 (2013.01); H05K 1/189 (2013.01); A61B 5/01 (2013.01); A61B 5/0402 (2013.01); A61B 5/053 (2013.01); A61B 2562/164 (2013.01); A61B 2562/166 (2013.01); H05K 1/0209 (2013.01); H05K 1/0283 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10401 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/1327 (2013.01);
Abstract

A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.


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