The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Dec. 04, 2017
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Motors Corporation, Seoul, KR;

Industry-academic Cooperation Foundation Gyeongsang National University, Jinju, Gyeongsangnam-do, KR;

Inventors:

SeungHyun Han, Gyeonggi-do, KR;

Jongpil Kim, Gyeonggi-do, KR;

Yongoh Choi, Gyeongsangnam-do, KR;

Wongyu Seol, Gyeongsangnam-do, KR;

Se-Kyo Chung, Gyeongsangnam-do, KR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); B60R 16/03 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0071 (2013.01); B60R 16/03 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H05K 1/165 (2013.01); H01F 2027/2809 (2013.01); H05K 1/0216 (2013.01); H05K 1/0298 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A vehicle electronic module is provided. The vehicle electronic module has a reduced size and improved productivity by replacing a sensor and an offset unit of an electromagnetic interference (EMI) filter module with a printed circuit board (PCB) winding structure. The electronic module includes a sensor that detects EMI noise of a power line and an offset unit that transmits an offset voltage for removing the EMI noise to the power line. A controller is configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor. Then sensor and the offset unit are formed in a stacked structure of the PCB.


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