The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Sep. 19, 2018
Applicant:

Gio Optoelectronics Corp, Tainan, TW;

Inventor:

Chin-Tang Li, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/32 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 3/32 (2013.01); H05K 3/321 (2013.01); H05K 3/4076 (2013.01); H01L 2224/16225 (2013.01); H05K 1/0313 (2013.01); H05K 3/007 (2013.01); H05K 2201/0179 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0373 (2013.01); H05K 2203/0353 (2013.01);
Abstract

An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.


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