The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

May. 16, 2019
Applicant:

Zf Friedrichshafen Ag, Friedrichshafen, DE;

Inventors:

Hermann Josef Robin, Regensburg, DE;

Martin Hempen, Regensburg, DE;

Thomas Maier, Neunburg v. Wald, DE;

Assignee:

ZF Friedrichshafen AG, Friedrichshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0207 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01);
Abstract

The invention relates to an electronic module () mounted on a transmission component (). The electronic module () comprises a printed circuit board element () that has component side () with at least one electronic component () and a contact side () lying opposite the component side (), and a heat conducting film () that is placed between a surface section of the contact side () lying opposite the component () and a surface section of the transmission component (). The printed circuit board element () can be or is tightened to the transmission component () such that the heat conducting film () is pressed against the surface section of the contact side () and the surface section of the transmission component ().


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