The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Oct. 21, 2016
Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Arinobu Nakamura, Mie, JP;
Tou Chin, Mie, JP;
AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka-Shi, Osaka, JP;
Abstract
Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.