The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Dec. 23, 2016
Applicant:
Ams Sensors Singapore Pte. Ltd., Singapore, SG;
Inventors:
Matthias Gloor, Boswil, CH;
Yit Chee Chiang, Singapore, SG;
Assignee:
ams Sensors Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01S 5/022 (2006.01); H01S 5/00 (2006.01); H01S 5/42 (2006.01); H01L 27/146 (2006.01); H01L 27/14 (2006.01); H01L 31/0232 (2014.01); H01K 1/08 (2006.01); G02B 7/02 (2006.01); H01L 31/0203 (2014.01); H01K 1/20 (2006.01); H01L 31/00 (2006.01); G02B 5/00 (2006.01); H01L 51/52 (2006.01); G02B 6/42 (2006.01); H01L 23/544 (2006.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02268 (2013.01); G02B 7/021 (2013.01); G02B 7/023 (2013.01); G02B 7/025 (2013.01); H01K 1/08 (2013.01); H01K 1/20 (2013.01); H01L 27/14 (2013.01); H01L 27/146 (2013.01); H01L 31/00 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01); H01S 5/005 (2013.01); H01S 5/0014 (2013.01); H01S 5/02208 (2013.01); H01S 5/02276 (2013.01); H01S 5/02288 (2013.01); H01S 5/423 (2013.01); G02B 5/003 (2013.01); G02B 5/005 (2013.01); G02B 6/4204 (2013.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14636 (2013.01); H01L 51/5237 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01S 5/02476 (2013.01);
Abstract
This disclosure describes an optoelectronic to provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The module includes spacers to establish precise separation distances between various parts of the module. One of the spacers serves as a support or mount for an optical element that comprises a mask.