The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Aug. 08, 2018
Applicant:

Quanta Computer Inc., Taoyuan, TW;

Inventors:

Chao-Jung Chen, Taoyuan, TW;

Yu-Nien Huang, Taoyuan, TW;

Kuen-Hsien Wu, Taoyuan, TW;

Kuo-Wei Lee, Taoyuan, TW;

Assignee:

QUANTA COMPUTER INC., Taoyuan, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/631 (2006.01); H01R 13/502 (2006.01); H05K 7/20 (2006.01); G02B 6/42 (2006.01); H04B 5/02 (2006.01);
U.S. Cl.
CPC ...
H01R 13/631 (2013.01); G02B 6/4261 (2013.01); G02B 6/4269 (2013.01); H01R 13/502 (2013.01); H04B 5/02 (2013.01); H05K 7/2049 (2013.01); H05K 7/20336 (2013.01); H05K 7/20481 (2013.01);
Abstract

A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.


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