The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Jun. 22, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Bum-hee Bae, Seongnam-si, KR;

Young-kun Kwon, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01B 7/08 (2006.01); H01P 11/00 (2006.01); H01B 13/00 (2006.01); H01P 5/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01P 3/08 (2013.01); H01B 7/0807 (2013.01); H01B 7/0823 (2013.01); H01B 13/0036 (2013.01); H01P 3/085 (2013.01); H01P 5/028 (2013.01); H01P 11/003 (2013.01); H05K 1/0218 (2013.01);
Abstract

A flexible flat cable and a manufacturing method thereof are provided. The flexible flat cable includes a plurality of ground parts comprising a conductive material disposed at intervals, a plurality of signal transmission parts comprising a conductive material disposed between the plurality of ground parts, an outer skin covering the signal transmission parts and the ground parts, and a conductive adhesive layer disposed between the ground parts and the signal transmission parts and the outer skin part, the signal transmission part comprising an insulating member and a strip line disposed within the insulating member and the ground part comprising a ground member having the same cross section as the strip line and a conductive adhesive block coupled to the ground member with the conductive adhesive layer.


Find Patent Forward Citations

Loading…