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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10651433 B1

PDFFull Text
Date of Patent:
May. 12, 2020

Filed:

Mar. 15, 2018

Packaging material for power storage device, and method of producing packaging material for power storage device

Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventors:

Wataru Ijuin, Tokyo, JP;

Satoshi Sasaki, Tokyo, JP;

Assignee:

TOPPAN PRINTING CO., LTD., Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Lawrence D Ferguson

Int. Cl.
CPC ...
B32B 27/36 (2006.01); H01M 2/02 (2006.01); H01G 11/78 (2013.01); B32B 15/00 (2006.01); H01G 11/82 (2013.01); B32B 7/12 (2006.01); B32B 15/085 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/32 (2006.01); B32B 37/02 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/12 (2006.01); B32B 37/15 (2006.01); B32B 38/00 (2006.01); H01G 11/84 (2013.01); H01M 10/0525 (2010.01);
U.S. Cl.
CPC ...
H01M 2/0287 (2013.01); B32B 7/12 (2013.01); B32B 15/00 (2013.01); B32B 15/085 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 37/02 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/1207 (2013.01); B32B 37/153 (2013.01); B32B 38/0008 (2013.01); H01G 11/78 (2013.01); H01G 11/82 (2013.01); H01G 11/84 (2013.01); H01M 2/0202 (2013.01); H01M 2/028 (2013.01); H01M 2/0277 (2013.01); H01M 2/0285 (2013.01); H01M 10/0525 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/26 (2013.01); B32B 2307/732 (2013.01); B32B 2310/14 (2013.01); B32B 2311/24 (2013.01); B32B 2323/10 (2013.01); B32B 2333/00 (2013.01); B32B 2367/00 (2013.01); B32B 2457/10 (2013.01); B32B 2457/16 (2013.01); H01M 2/026 (2013.01); H01M 2002/0297 (2013.01); H01M 2220/30 (2013.01); Y02E 60/13 (2013.01);
Abstract

A packaging material for a power storage device having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. In the packaging material, the substrate layer is formed of a polyester film having a 50% elongation stress in the range of 100 to 180 MPa and a thermal shrinkage in the range of 1 to 15%, after heat treatment from 160° C. to 200° C., or a polyester film having a difference ΔA in break elongation of 12% or more after heat treatment at 200° C. and 160° C. and having a 50% elongation stress of 75 MPa or more after heat treatment at 200° C.

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