The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Nov. 09, 2016
Applicant:

Novaled Gmbh, Dresden, DE;

Inventors:

Tomas Kalisz, Dresden, DE;

Francois Cardinali, Dresden, DE;

Jerome Ganier, Dresden, DE;

Uwe Gölfert, Tharandt, DE;

Vygintas Jankus, Dresden, DE;

Carsten Rothe, Dresden, DE;

Benjamin Schulze, Dresden, DE;

Steffen Willmann, Dresden, DE;

Assignee:

Novaled GmbH, Dresden, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/50 (2006.01); C23C 14/14 (2006.01); C23C 14/24 (2006.01); C23C 28/00 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0021 (2013.01); C23C 14/14 (2013.01); C23C 14/24 (2013.01); C23C 28/00 (2013.01); H01L 51/001 (2013.01); H01L 51/002 (2013.01); H01L 51/441 (2013.01); H01L 51/5092 (2013.01); H01L 51/5203 (2013.01); Y02E 10/549 (2013.01);
Abstract

The present invention relates to a metallic layer adjacent to a semiconducting layer comprising a substantially covalent matrix material, the metallic layer comprising at least one first metal and at least one second metal, wherein a) the first metal is selected from the group consisting of Li, Na, K, Rb, Cs; and b) the second metal is selected from the group consisting of Zn, Hg, Cd, Te, electronic devices comprising such materials and process for preparing the same.


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