The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Aug. 25, 2017
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Rongming Chu, Newbury Park, CA (US);

Yu Cao, Agoura Hills, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/15 (2006.01); H01L 29/205 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01); H01L 29/207 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7785 (2013.01); H01L 29/155 (2013.01); H01L 29/205 (2013.01); H01L 29/66462 (2013.01); H01L 29/7781 (2013.01); H01L 29/2003 (2013.01); H01L 29/207 (2013.01); H01L 29/4236 (2013.01);
Abstract

A III-nitride power handling device and the process of making the III-nitride power handling device are disclosed that use digital alloys as back barrier layer to mitigate the strain due to lattice mismatch between the channel layer and the back barrier layer and to provide increased channel conductivity. An embodiment discloses a GaN transistor using a superlattice binary digital alloy as back barrier comprising alternative layers of AlN and GaN. Other embodiments include using superlattice structures with layers of GaN and AlGaN as well as structures using AlGaN/AlGaN stackups that have different Aluminum concentrations. The disclosed device has substantially increased channel conductivity compared to traditional analog alloy back barrier devices.


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