The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Jun. 06, 2018
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Keita Torii, Naka-gun, JP;

Takashi Usui, Ashigarakami-gun, JP;

Takuji Mukai, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/66 (2006.01); H01L 21/027 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14685 (2013.01); H01L 21/0217 (2013.01); H01L 21/0273 (2013.01); H01L 21/02164 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/823864 (2013.01); H01L 22/26 (2013.01); H01L 27/1462 (2013.01); H01L 27/14612 (2013.01); H01L 27/14689 (2013.01); H01L 22/12 (2013.01);
Abstract

A method of manufacturing a semiconductor device is provided. The method comprises forming a first insulator above the substrate, forming a second insulator on the first insulator, performing a first etching process of etching the second insulator by fluorine and hydrogen contained gas to expose the first insulator while leaving a portion of the second insulator which covers a side face of the gate electrode and performing a second etching process of etching a portion of the first insulator exposed by the first etching process. The first etching process includes a first process and a second process performed after the first process. A reaction product is less deposited in the first process than in the second process and etching selectivity of the second insulator with respect to the first insulator is higher in the second process than in the first process.


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