The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Sep. 19, 2018
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Timothy Canning, Morgan Hill, CA (US);

Bjoern Herrmann, Morgan Hill, CA (US);

Richard Wilson, Morgan Hill, CA (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H03F 3/195 (2006.01); H03F 1/56 (2006.01); H01L 23/053 (2006.01); H01L 23/13 (2006.01); H03F 3/60 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 23/053 (2013.01); H01L 23/13 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/601 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01); H03F 2200/222 (2013.01); H03F 2200/225 (2013.01); H03F 2200/387 (2013.01); H03F 2200/391 (2013.01); H03F 2200/451 (2013.01);
Abstract

Embodiments of an RF amplifier package include a body section comprising an upper surface having first and second opposing edge sides, and a die pad vertically recessed beneath the upper surface and comprising first and second opposing sides and a third side intersecting with the first and second sides. Embodiments also include first and second leads disposed on the upper surface, the second lead extending from adjacent to the second side to the second edge side; and a biasing strip connected to the second lead and disposed on the upper surface adjacent to the third side. Other embodiments include packaged RF amplifiers comprising an RF amplifier package, and an RF transistor mounted on the die pad and comprising: a control terminal electrically coupled to the first lead, a reference potential terminal directly facing and electrically connected to the die pad, and an output terminal electrically connected to the second lead.


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