The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Sep. 28, 2018
Applicants:

Nidec Corporation, Minami-ku, Kyoto, JP;

Wgr Co., Ltd., Shimogyo-ku, Kyoto, Kyoto, JP;

Inventors:

Hideki Kirino, Kyoto, JP;

Hiroyuki Kamo, Kyoto, JP;

Assignees:

NIDEC CORPORATION, Kyoto, JP;

WGR CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/66 (2006.01); H01P 3/08 (2006.01); H01P 3/123 (2006.01); G01S 13/34 (2006.01); G01S 13/931 (2020.01); H01L 23/367 (2006.01); H01P 3/12 (2006.01); H01P 5/12 (2006.01); H01P 3/02 (2006.01); G01S 13/93 (2020.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); G01S 13/34 (2013.01); G01S 13/931 (2013.01); H01L 23/367 (2013.01); H01P 3/085 (2013.01); H01P 3/121 (2013.01); H01P 3/123 (2013.01); G01S 2013/9371 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01); H01P 3/026 (2013.01); H01P 5/12 (2013.01);
Abstract

A microwave IC waveguide device module includes: a substrate having a throughhole; a microwave IC provided on or above the first face of the substrate; a waveguide member provided below the second face of the substrate opposite from the first face, the waveguide member having an electrically conductive waveguide face which opposes the throughhole; an electrically conductive member covering at least a portion of the second face that extends in a manner of following along the waveguide face; and an artificial magnetic conductor on both sides of the waveguide member. The substrate includes an inner-wall electrically conductive portion covering an inner wall of the throughhole and being electrically connected with the electrically conductive member. The signal terminal and the ground terminal of the IC are electrically connected respectively with two portions of the inner-wall electrically conductive portion opposing each other with the throughhole interposed therebetween.


Find Patent Forward Citations

Loading…