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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10651121 B1

PDFFull Text
Date of Patent:
May. 12, 2020

Filed:

Apr. 16, 2019

Semiconductor device manufacturing method including forming a wide portion spreading over a looped portion

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Daisuke Oya, Tokyo, JP;

Satoshi Yokota, Hyogo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Quoc D Hoang

Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01R 4/06 (2006.01); H01L 23/34 (2006.01); H01R 4/30 (2006.01); H01R 4/48 (2006.01); H01R 4/56 (2006.01); H01R 12/70 (2011.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/053 (2013.01); H01L 23/49838 (2013.01); H01L 24/34 (2013.01); H01L 23/34 (2013.01); H01L 23/49861 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01R 4/06 (2013.01); H01R 4/308 (2013.01); H01R 4/48 (2013.01); H01R 4/56 (2013.01); H01R 12/7076 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip, an electrode electrically connected to the semiconductor chip, the electrode including a looped portion, a cylindrical electrode including a main portion having a screw thread formed therein and a narrow portion continuous with the main portion, the narrow portion having a smaller width than the main portion, the cylindrical electrode being electrically connected to the electrode by the narrow portion being inserted into the looped portion, and a case for the semiconductor chip and the electrode, the case contacting the main portion while causing the screw thread and a connecting portion between the looped portion and the cylindrical electrode to be exposed.

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