The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Apr. 16, 2019
Applicant:
Denso Corporation, Kariya, Aichi-pref., JP;
Inventors:
Kosuke Suzuki, Kariya, JP;
Atsushi Kashiwazaki, Kariya, JP;
Yuki Sanada, Kariya, JP;
Toshihiro Nakamura, Kariya, JP;
Shinya Uchibori, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 3/28 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/28 (2013.01); H01L 23/49827 (2013.01); H05K 1/111 (2013.01); H05K 1/114 (2013.01); H05K 1/181 (2013.01); H05K 3/28 (2013.01); H01L 23/31 (2013.01); H05K 2201/099 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/09236 (2013.01);
Abstract
A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.