The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Jul. 08, 2019
Infineon Technologies Ag, Neubiberg, DE;
Syahir Abd Hamid, Melaka, MY;
Jagen Krishnan, Melaka, MY;
Mian Mian Lam, Sarawak, MY;
Jayaganasan Narayanasamy, Melaka, MY;
Fabian Schnoy, Regenstauf, DE;
Thomas Stoek, Buxtehude, DE;
Christian Stuempfl, Schmidgaden, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of forming a semiconductor device includes providing a semiconductor package comprising an electrically insulating mold compound body, a semiconductor die that is encapsulated by the mold compound body, a plurality of electrically conductive leads that each protrude out of the mold compound body, and a metal heat slug, the metal heat slug comprising a rear surface that is exposed from the mold compound body, coating outer portions of the leads that are exposed from the mold compound body with a metal coating, and after completing the coating of the outer portions of the leads, providing a planar metallic heat sink interface surface on the semiconductor device which is exposed from the mold compound body, and substantially devoid of the metal coating.