The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Aug. 29, 2018
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Hironori Asano, Tokyo, JP;
Noriaki Matsuno, Tokyo, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 3/282 (2006.01); H01F 17/00 (2006.01); H03H 7/01 (2006.01); H01L 27/06 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01); H01L 23/64 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0006 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 27/0629 (2013.01); H03H 7/1725 (2013.01); H03H 7/1741 (2013.01); H01F 2017/0026 (2013.01); H03H 7/0115 (2013.01); H03H 2001/0085 (2013.01);
Abstract
A semiconductor device capable of reducing in size thereof and suppressing degradation in the characteristics of circuit components is provided. The semiconductor device includes an LC circuit comprised of a spiral inductor provided over a semiconductor substrate and a capacitive element coupled with the spiral inductor. The spiral inductor includes a central area encircled with a metal wiring and a peripheral area other than the central area. The capacitive element is formed in an upper-layer or a lower-layer position corresponding to the peripheral area other than the central area.