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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10649503 B1

PDFFull Text
Date of Patent:
May. 12, 2020

Filed:

Jun. 29, 2017

Device comprising compressed thermal interface material (tim) and electromagnetic (emi) shield comprising flexible portion

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Vivek Sahu, San Diego, CA (US);

Mehdi Saeidi, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Loza & Loxa, LLP/Qualcomm

Primary Examiner:

Steven B Gauthier

Int. Cl.
CPC ...
G06F 1/18 (2006.01); H01L 23/40 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H05K 3/36 (2006.01); H01L 25/065 (2006.01); H01L 23/42 (2006.01); H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
G06F 1/182 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/4334 (2013.01); H01L 23/552 (2013.01); H01L 24/73 (2013.01); H05K 3/361 (2013.01); H01L 21/56 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.

Find Patent Forward Citations

Sahu, Vivek. (2020). Device comprising compressed thermal interface material (tim) and electromagnetic (emi) shield comprising flexible portion (U.S. Patent No. 10649503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10649503

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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