The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Jun. 29, 2017
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Vivek Sahu, San Diego, CA (US);
Mehdi Saeidi, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/18 (2006.01); H01L 23/40 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H05K 3/36 (2006.01); H01L 25/065 (2006.01); H01L 23/42 (2006.01); H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
G06F 1/182 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/4334 (2013.01); H01L 23/552 (2013.01); H01L 24/73 (2013.01); H05K 3/361 (2013.01); H01L 21/56 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.