The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Jul. 08, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Naoyuki Takeda, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/30 (2006.01); B24B 1/00 (2006.01); B24B 7/22 (2006.01); B24B 9/00 (2006.01); H01L 21/304 (2006.01); B24B 9/06 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); H01L 21/02 (2006.01); H01L 29/32 (2006.01);
U.S. Cl.
CPC ...
G03F 7/3092 (2013.01); B24B 1/00 (2013.01); B24B 7/22 (2013.01); B24B 7/228 (2013.01); B24B 9/00 (2013.01); B24B 9/065 (2013.01); G03F 7/039 (2013.01); G03F 7/162 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); H01L 21/02035 (2013.01); H01L 21/304 (2013.01); H01L 29/32 (2013.01);
Abstract
The present invention has an object of providing a stepped wafer that can prevent a resist from remaining after development, and a method for manufacturing the stepped wafer. The stepped wafer according to the present invention is a stepped wafer having a step and whose main surface is thinner in a center portion and is thicker in an outer periphery. The step includes a curved surface with a radius of curvature ranging from 300 μm to 1800 μm.