The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Jul. 14, 2017
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Kenji Sasaki, Tokyo, JP;

Shinji Iwatsuka, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/035 (2006.01); G02B 6/12 (2006.01); G02F 1/03 (2006.01); G02F 1/225 (2006.01); G02B 5/30 (2006.01); G02B 6/122 (2006.01);
U.S. Cl.
CPC ...
G02F 1/035 (2013.01); G02B 5/30 (2013.01); G02B 6/12 (2013.01); G02B 6/122 (2013.01); G02F 1/03 (2013.01); G02F 1/0316 (2013.01); G02F 1/225 (2013.01); G02F 2201/07 (2013.01); G02F 2202/20 (2013.01);
Abstract

A dielectric thin film-applied substrate that suppresses occurrence of cracks when the film thickness of the lithium niobate film is equal to or larger than 1 μm. The dielectric thin film-applied substrate includes a single crystal substrate and a dielectric thin film made of c-axis oriented lithium niobate epitaxially formed on a main surface of the single crystal substrate. The dielectric thin film has a twin crystal structure including first and second crystals 180° apart, centered on the c-axis. In pole figure measurement by X-ray diffraction, the ratio between a first diffraction intensity corresponding to the first crystal and a second diffraction intensity corresponding to the second crystal is equal to or higher than 0.5 and equal to or lower than 2.0, which alleviates distortions accumulated inside the lithium niobate film and supresses occurrences of cracks accompanying increases in the film thickness.


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