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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10649241 B1

PDFFull Text
Date of Patent:
May. 12, 2020

Filed:

Mar. 23, 2018

Multi-function semiconductor and electronics processing

Applicant:

Nlight, Inc., Vancouver, WA (US);

Inventors:

David Martin Hemenway, Beaverton, OR (US);

Ken Gross, Vancouver, WA (US);

Dahv A. V. Kliner, Portland, OR (US);

Roger Farrow, Vancouver, WA (US);

Assignee:

NLIGHT, INC., Vancouver, WA (US);

Attorney:

Schwabe Williamson & Wyatt

Primary Examiner:

Peter Radkowski

Int. Cl.
CPC ...
G02F 1/01 (2006.01); G02B 27/09 (2006.01); G02B 6/42 (2006.01); G02B 6/255 (2006.01); G02B 6/26 (2006.01); G02B 6/036 (2006.01); G02B 6/028 (2006.01); B23K 26/06 (2014.01); B23K 26/21 (2014.01); B23K 26/073 (2006.01); B23K 26/38 (2014.01); B23K 1/00 (2006.01); B23K 26/34 (2014.01); B23K 1/005 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
G02F 1/0115 (2013.01); B23K 1/0016 (2013.01); B23K 1/0056 (2013.01); B23K 26/0643 (2013.01); B23K 26/0648 (2013.01); B23K 26/0732 (2013.01); B23K 26/0736 (2013.01); B23K 26/21 (2015.10); B23K 26/34 (2013.01); B23K 26/38 (2013.01); G02B 6/0281 (2013.01); G02B 6/03622 (2013.01); G02B 6/03638 (2013.01); G02B 6/03661 (2013.01); G02B 6/2551 (2013.01); G02B 6/262 (2013.01); G02B 6/4296 (2013.01); G02B 27/0927 (2013.01); G02B 27/0994 (2013.01); B23K 2101/42 (2018.08);
Abstract

A method of tailoring beam characteristics of a laser beam during fabrication of an electronic device. The method includes: providing a substrate comprising one or more layers; adjusting one or more characteristics of a laser beam; and impinging the laser beam having the adjusted beam characteristics on the substrate to carry out at least one process step for fabricating the electronic device. The adjusting of the laser beam comprises: perturbing the laser beam propagating within a first length of fiber to adjust the one or more beam characteristics of the laser beam in the first length of fiber or a second length of fiber or a combination thereof, the second length of fiber having two or more confinement regions; coupling the perturbed laser beam into the second length of fiber; and emitting the laser beam having the adjusted beam characteristics from the second length of fiber.

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