The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Nov. 02, 2016
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Takahiro Shinohara, Hyogo, JP;

Hitoshi Yoshida, Osaka, JP;

Kazuo Goda, Osaka, JP;

Rie Okamoto, Osaka, JP;

Hiroshi Nakatsuka, Osaka, JP;

Masako Yamaguchi, Osaka, JP;

Hideki Ueda, Fukui, JP;

Takanori Aoyagi, Osaka, JP;

Yuki Maegawa, Osaka, JP;

Takuya Kajiwara, Osaka, JP;

Keisuke Kuroda, Fukui, JP;

Takeshi Mori, Fukui, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/08 (2006.01); G01P 15/125 (2006.01); G01P 15/18 (2013.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); G01P 15/0802 (2013.01); G01P 15/18 (2013.01); H01L 29/84 (2013.01); G01P 2015/0862 (2013.01);
Abstract

A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.


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